原文标题：
India is betting $18 billion to build a chip powerhouse. Here’s what it means
原文连结：https://tinyurl.com/2bj59v6s
发布时间：Mon, Sep 22 2025 6:58 PM EDT
记者署名：Priyanka Salve
原文内容：
India wants to become a global chip major, but the odds are steep: competition
is fierce, and India is a late entrant in the race to make the most advanced
chips.
印度希望成为全球芯片大国，但机率并不高：竞争激烈，而印度又是先进芯片竞赛的迟来
者。
In 2022, when the U.S. restricted exports of its advanced AI chips to China to
curb Beijing’s access to cutting-edge technology, a global race for
semiconductor self-reliance began.
2022年，美国限制对中国出口先进AI芯片以遏制北京获取尖端技术，全球半导体自给自足
的竞赛由此展开。
For India, it offered an opportunity: the country wants to reduce dependence
on imports, secure chips for strategic sectors, and capture a bigger share of
the global electronics market shifting away from China.
对印度来说，这是个机会：该国希望减少对进口的依赖，确保战略产业的芯片供应，并夺
取全球电子市场中正从中国转移的一部分份额。
India is one of the world’s largest consumers of electronics, but it has no
local chip industry and plays a minimal role in the global supply chain. New
Delhi’s “Semiconductor Mission” aims to change that.
印度是全球最大的电子产品消费国之一，但本土没有芯片产业，在全球供应链中几乎无足
轻重。新德里的“半导体任务”旨在改变这一点。
The ambition is bold. It wants to create a full supply chain — from design to
fabrication, testing and packaging — on Indian soil.
这个野心很大：它希望在印度境内建立完整的供应链，从设计到制造、测试与封装。
As of this month, the country has approved 10 semiconductor projects with
total investment of 1.6 trillion rupees ($18.2 billion). These include two
semiconductor fabrication plants, and multiple testing and packing factories.
截至本月，印度已批准10个半导体专案，总投资1.6兆卢比（约182亿美元）。其中包括两
座晶圆厂，以及多个测试与封装工厂。
India also has a pool of engineering talent that is already employed by global
chip design companies.
印度还有一批工程人才，已经受聘于全球芯片设计公司。
Yet progress so far has been uneven, and neither the investments nor talent
pool is enough to make India’s chip ambitions a reality, say experts.
然而，专家表示，目前进展不均衡，无论投资还是人才库，都不足以让印度的芯片梦想成
真。
“India needs more than a few fabs or ATP facilities (i.e., more than a few “
shiny objects.”) It needs a dynamic and deep and long-term ecosystem,” said
Stephen Ezell, vice president for global innovation policy at the Information
Technology and Innovation Foundation, a science and technology policy think
tank.
“印度需要的不只是几座晶圆厂或封测厂（即一些‘亮眼的项目’），而是一个有活力、
深度且长期的生态系统，”科技政策智库 ITIF 全球创新政策副总裁 Stephen Ezell 说
。
Ezell says that leading semiconductor manufacturers consider “as many as 500
discrete factors” before they set up multi-billion-dollar fab investments.
These include talent, tax, trade, technology policies, labor rates and laws
and customs policies — all areas where India has work to do.
Ezell 表示，顶尖半导体制造商在决定数十亿美元的晶圆厂投资前，会考虑“多达500项
因素”。这包括人才、税制、贸易、科技政策、劳动力成本与法律，以及海关政策——而
这些领域印度仍有大量工作要做。
New Delhi’s policy push
新德里的政策推动
In May, the Indian government added a new element to its chip ambition: a
scheme to support electronic component manufacturing, addressing a critical
bottleneck.
5月，印度政府为芯片计画增添新元素：一项支持电子零组件制造的计画，以解决关键瓶
颈。
Until now, chipmakers had no local demand for their product as there are
hardly any electronic component manufacturing companies, such as phone camera
companies, in India.
直到现在，芯片制造商在印度没有本地需求，因为该国几乎没有电子零组件制造公司，例
如手机镜头厂商。
But the new policy offers financial support to companies producing active and
passive electronic components, creating a potential domestic buyer-supplier
base that chip manufacturers can plug into.
但这项新政策为主动与被动电子零件公司提供资金支持，创造潜在的国内买卖关系网，让
芯片制造商可以接轨。
In 2022, the country also pivoted from its strategy of providing superior
incentives to fabrication units making chips of 28nm or less. … New Delhi now
covers 50% of the project costs of all fabrication units, regardless of chip
size, and of chip testing and packing units.
2022年，印度也调整了政策，不再只针对28奈米以下的芯片制造厂提供优惠。如今，新德
里将承担所有晶圆厂（无论芯片大小）及封测厂50%的专案成本。
Fab companies from Taiwan and the U.K., and semiconductor packaging companies
from the U.S. and South Korea have all shown interest in aiding India’s
semiconductor ambitions.
来自台湾与英国的晶圆厂商，以及美国与韩国的半导体封装公司，都表示有兴趣协助印度
的半导体计画。
“The Indian government has doled out generous incentives to attract
semiconductor manufacturers to India,” said Ezell, but he stressed that “
those sorts of investments aren’t sustainable forever.”
“印度政府已祭出丰厚的补贴吸引半导体制造商来印度，”Ezell 说，但他强调“这类投
资不可能永续。”
The long road
漫长的道路
The biggest chip project in India currently is the 910-billion-rupee ($11
billion) semiconductor fabrication plant being built in Prime Minister
Narendra Modi’s home state of Gujarat by Tata Electronics, in partnership
with Taiwan’s Powerchip Semiconductor Manufacturing Corp.
目前印度最大的芯片专案，是由塔塔电子与台湾力晶合作，在总理莫迪的家乡古吉拉特邦
建造的9100亿卢比（110亿美元）晶圆厂。
The unit will make chips for power management integrated circuits, display
drivers, microcontrollers and high-performance computing logic, Tata
Electronics said, which can be used in AI, automotive, computing and data
storage industries.
塔塔电子表示，该厂将生产电源管理IC、显示驱动器、微控制器和高效能运算逻辑芯片，
可用于AI、汽车、运算与数据储存等产业。
The U.K.’s Clas-SiC Wafer Fab has also tied up with India’s SiCSem to set up
the country’s first commercial compound fab in the eastern state of Odisha.
英国 Clas-SiC Wafer Fab 也与印度 SiCSem 合作，在东部奥里萨邦设立该国第一座商用
化合物半导体厂。
These compound semiconductors can be used in missiles, defence equipment,
electric vehicles, consumer appliances and solar power inverters, according to
a government press release.
根据政府新闻稿，这些化合物半导体可用于飞弹、国防装备、电动车、消费电子与太阳能
逆变器。
“The coming 3-4 years is pivotal for advancing India’s semiconductor goals,
” said Sujay Shetty, managing director of semiconductor at PwC India.
“未来3至4年对推进印度的半导体目标至关重要，”PwC 印度半导体部门董事总经理
Sujay Shetty 说。
Opportunities beyond fab
超越晶圆厂的机会
Fabrication sites need to meet stringent requirements … with reliable road
connectivity — which can present ongoing logistical considerations for some
regions.
晶圆厂场址需要严格条件，例如避免洪水与震动，并具备可靠的道路连结——这对部分地
区是一大后勤挑战。
India also needs specialty chemical suppliers that meet “ultra-high purity
standards essential for advanced semiconductor manufacturing,” Shetty added.
Shetty 补充，印度还需要能达到“超高纯度标准”的特殊化学品供应商，这是先进半导
体制造不可或缺的。
Beyond chip fabrication plants, many medium-sized companies in India have
shown interest in setting up chip testing and packaging units … attracted by
its higher margins and lower capital intensity compared to fabs.
除了晶圆厂之外，许多印度中型企业也有意建立测试与封装厂，因为相比晶圆厂，其利润
较高、资本需求较低。
“Outsourced semiconductor assembly and testing (OSAT) represents a
significant opportunity for India, though clarifying market access and demand
channels will be important for sustained growth,” says Shetty.
“外包半导体组装与测试（OSAT）对印度是一大机会，但必须明确市场进入与需求管道，
才能实现持续成长，”Shetty 说。
Success in this area will see India enter the global chip industry, but New
Delhi is still a long way from locally developing and manufacturing the
cutting-edge of chip technology: 2nm semiconductors.
若在这方面成功，印度将能进入全球芯片产业，但距离本地开发与制造最先进的2奈米晶
片，仍有很长一段路。
Last week, Indian minister Ashwini Vaishnaw … said the British company will
design the “most advanced chips used in AI servers, drones, mobile phone
chips of 2 nm” from the south Indian city.
上周，印度部长 Ashwini Vaishnaw 在班加罗尔为ARM新办公室揭幕时表示，这家英国公
司将从南印度设计“用于AI服务器、无人机与2奈米手机芯片的最先进芯片”。
But experts say the role of local talent is likely to be limited to non-core
design testing and validation, as the core intellectual property for chip
designs is often held in locations like the U.S. or Singapore.
但专家表示，本地人才的角色可能仅限于非核心的设计测试与验证，因为芯片设计的核心
智慧财产权往往掌握在美国或新加坡等地。
“India has sufficient talent in design space … design has been there since
1990s,” said Jayanth BR, a recruiter … He said global companies usually
outsource “block-level” design validation work to India.
“印度在设计领域有人才，因为不同于近两年才兴起的制造与测试，设计自1990年代就存
在，”有15年以上半导体招聘经验的 Jayanth BR 说。他表示，全球公司通常将“区块层
级”的设计验证工作外包给印度。
“India may consider updating its IP laws … Our competition is with countries
like the U.S., Europe, and Taiwan, which not only have strong IP laws, but
also a more established ecosystem for chip design.”
“印度可能需要更新其智慧财产权法律 … 我们的竞争对手是美国、欧洲与台湾，这些国
家不仅有强大的智慧财产权法律，还有更成熟的芯片设计生态，”孟买律所 JSA 的合伙
人 Sajai Singh 说。
心得/评论：
缺乏完整生态系统
半导体不是单一工厂，而是从设计、材料、设备、化学品到供应链的庞大网络。
印度目前仅有零散项目，缺乏深度整合。
基础建设不足
晶圆厂对水电、交通、防震要求极高，印度不符合条件，后勤难以长期维持。
人才结构不匹配
设计人才多，但制造与先进制程人才不足。
高阶设计与核心IP仍掌握在美国/台湾/新加坡。
政策可持续性问题
政府提供的50%补贴极其昂贵，长期不可持续，
外企可能趁补助期间进驻，补助结束后撤离。
智慧财产权法律薄弱
核心IP容易流失，国际大厂不敢将关键技术放在印度。
国际竞争激烈
印度不仅落后台积电、三星、Intel数十年
，连中国都已有较完整的制造能力，印度更显劣势。
本地需求不足
印度虽是电子产品大国，但零组件多仰赖进口，
短期内难以形成支撑半导体大规模投产的本土市场。