这种新闻习惯上都会去找一下来源
应该是下面这篇 英文好的可以直接看
后面补上copilot翻译的中文版本
来源：https://reurl.cc/gYM48R
原文如下
标题：
Apple and Intel 14A: A lifeline for Intel or just a tactical threat against
TSMC?
苹果与英特尔 14A：是英特尔的救命绳，还是对台积电的战术威胁？
日期：27. July 2025 06:00 Samir Bashir
Apple flirting with Intel is like the head of the class looking over the math
homework of the nerdy person sitting next to him out of pity – polite,
perhaps genuinely curious, but rarely long-term. Nevertheless, according to
Jeff Pu (GF Securities), what is leaking out is not without explosive force,
report our colleague Muhammad Zuhair from WccfTech: Apple is said to be
evaluating early versions of Intel’s 14A process (1.4 nm). And NVIDIA is
also reportedly putting out feelers. Sounds like silicone romance, but could
be pure power politics at the level of global semiconductor dependencies.
苹果公司与英特尔之间的接触，犹如班上成绩优异的学生出于善意而翻阅邻座书呆子的数
学作业——表面上礼貌，或许怀有真诚的好奇心，但极少具有长期性合作的意图。然而，
根据 GF Securities 的分析师 Jeff Pu 所透露的讯息，我们的同事 Muhammad Zuhair（
WccfTech 报导）指出：此事的外泄内容可能具有重大影响力。据悉，苹果目前正在评估
英特尔 14A 制程（1.4 奈米）之初期版本；此外，辉达（NVIDIA）亦传出正在释出合作
意向。这一系列动作表面上看似半导体领域的策略合作，但更可能代表一场围绕全球半导
体供应链依赖所展开的权力竞局。
Intel 14A: A process between hope and ultimatum
The story is quickly told, but deeply ramified: Intel has its back to the
wall. The foundry business is in deficit, the industry’s trust is as full of
holes as Swiss cheese – just think of Intel’s failed 10 nm odyssey and the
eternal promise “next year we’ll be back in front”. So now the big hit:
14A – a process node based on the PowerVia backbone of the 18A, spiced up
with 2nd Gen RibbonFET and PowerDirect. Sounds futuristic, yes, but above all
it is a desperate appeal: “Buy from us, otherwise we’ll drop out of the
node rally!” An ultimatum that means something like: If Apple and NVIDIA don
’t get on board, that’s it for Intel’s ambition to become a semiconductor
superpower again.
Intel 14A：介于希望与最后通牒之间的制程节点
这个故事虽可简短叙述，却牵动深远：英特尔目前处于艰困处境。其晶圆代工业务长期亏
损，产业对其信任如同瑞士乳酪般千疮百孔——回顾英特尔在 10 奈米制程上的挫败历程
，以及多年来未曾实现的“明年我们将重返领先”承诺，即可略见一斑。
如今，英特尔寄予厚望的突破点是 14A 制程节点。该技术建立在 18A 制程的 PowerVia
架构之上，并结合第二代 RibbonFET 及 PowerDirect 技术。尽管展现未来性，最核心的
仍是一项迫切呼吁：“请选择我们，否则我们将退出先进制程竞争。”
这项讯息的实质意涵即是：若苹果与辉达未选择采用该制程节点，英特尔重新夺回半导体
领导地位的企图恐将功败垂成。
Apple: between diversification and blackmail
Why would Apple, TSMC’s premium customer, suddenly come knocking on Intel’s
door? Quite simply: pressure. TSMC is currently holding the chip world
hostage. If you want high-end, you have to pay. And those who don’t pay
simply don’t get any capacity or are put off until later slots. An untenable
situation for Apple. Especially in view of the fact that TSMC will not bring
its new production facilities (A14, not to be confused with Apple’s SoC of
the same name) into series production until 2028. A dual sourcing model with
Intel would therefore be more of a threat than a technical necessity. Apple
is showing TSMC the yellow card: “If you become too expensive or too slow, we
’ll go to Intel.” Of course, only if Intel delivers at all by then. And
this is precisely where the problem lies: PDK samples and 5-nines yield are
worlds apart.
Apple：介于供应多元化与策略施压之间
苹果公司作为台积电的核心高端客户，为何突然转向英特尔表达兴趣？原因其实非常明确
：市场压力。台积电目前在高阶芯片制程领域拥有主导地位，对整个芯片市场形成高度依
赖。欲取得先进制程的产能，客户须支付高额代价；未愿付出者则往往被排入后续时程或
直接排除于外。这样的情况对苹果而言已难以承受。
尤其需要注意的是，台积电预计要到 2028 年才会将其最新的 A14 制程技术（注意：与
苹果自家命名的 A14 SoC 并无关联）导入量产阶段。在此背景下，与英特尔启动双重采
购模式，更像是苹果的一项策略性威胁，而非出于技术需求。其意图明确：向台积电示警
——“若你变得太昂贵或进度太慢，我们将转向英特尔。”
但此举能否付诸实行，仍取决于英特尔是否具备交付能力。事实上，仅有设计开发套件（
PDK）并不代表已达量产良率标准。在业界要求达成“五个九”（99.999%）良率的高度门
槛下，设计阶段与实际生产间仍存在巨大的技术落差。
NVIDIA: The AI monolith is looking for new foundries
The fact that NVIDIA is also being touted as an interested party is less
surprising. The entire AI industry is currently steaming like an overheated
reactor, and TSMC’s output is not enough. A second supplier would be worth
its weight in gold for NVIDIA – especially in the mid-range GPU segment. But
here too, everything is still on paper. No tape-outs, no test chips, no
concrete deals. Rumor has it that Intel has already poached high-ranking TSMC
engineers from Arizona – a tactical move, but no proof of production
readiness. And manufacturing is not a LinkedIn profile, but hard
infrastructure, long-term contracts, machines, lithography expertise and,
last but not least, trust.
NVIDIA：AI 巨头积极寻找新晶圆代工伙伴
NVIDIA 被认为是可能的合作方之一，其实并不令人意外。眼下整个 AI 产业如同过热的
反应炉般迅速膨胀，而台积电的产能显然无法充分应对市场需求。对 NVIDIA 而言，特别
是在中阶 GPU 市场领域，寻求第二供应来源将极具战略价值。
然而，目前所有计画仍停留在纸上谈兵阶段——尚无设计定案（tape-out）、无测试芯片
，也未达成任何具体合作协议。有市场传闻指出，英特尔已在亚利桑那州挖角多位台积电
高阶工程师，作为策略布局的一环，但此举并不能视为具备量产能力的明确证据。
值得强调的是，芯片制造不仅是人才履历的堆叠，更是建构于实体基础设施之上的长期投
资：包括生产设备、微影技术专业、稳定的契约架构，以及最重要的——产业信任。
A strategic mix: semiconductors as a diplomatic currency
What at first glance seems like a minor industry announcement is actually
part of a global game. Intel – once the guardian of Moore’s Law – is now a
supplicant. Apple – the tech oligarch of the post-PC era – is using its
market position to play suppliers off against each other. And TSMC – the
quasi-monopolist – threatens to become the structural weak point of the
Western tech world, especially in view of Taiwan’s geopolitical fragility.
If Apple gets involved with Intel, it will not be out of charity, but out of
strategic calculation: spreading risk, pushing down prices, securing
production time. If Intel is able to deliver – which as things stand today
is more of a wish than a reality – an alternative axis of power will emerge
in the chip war.
战略混合：半导体作为外交筹码
乍看之下只是一则产业消息，实际上却是全球布局的一环。英特尔——曾经是摩尔定律的
守护者，如今成了市场的请求者；苹果——后 PC 时代的科技寡头——正运用其市场地位
，在供应商之间进行策略性的博弈；而台积电——近乎垄断的晶圆代工巨擘——在台湾地
缘政治脆弱性的影响下，有可能成为西方科技体系的结构性弱点。
若苹果选择与英特尔合作，动机绝非基于善意，而是基于精密的策略考量：分散供应风险
、压低生产成本，并确保芯片制造时程。如果英特尔能够如期达成交付能力——以目前情
况而言仍属愿景而非现实——则在半导体竞争格局中将可能形成一条新的权力轴线。
Conclusion: beacon of hope or smokescreen?
For Intel, an Apple or NVIDIA deal with 14A would be the saving straw. For
Apple, it is an option for a better negotiating position. A warning shot for
TSMC. But nothing is fixed yet. No wafer has been delivered, no SoC is
running. Only PDKs, roadmaps and analyst speculation. You could also say that
the ball is on the pitch – but the pitch is still under construction. And
whether Intel plays along or is left on the bench again will only be decided
when Apple says: “Tape-out, we’re in.” Until then, it’s all just
diplomatic haggling – with silicon as the pawn sacrifice.
结论：希望灯塔，抑或烟雾弹？
对英特尔而言，与苹果或辉达在 14A 制程上的合作，无疑可能成为扭转局势的关键契机
；而对苹果而言，这是一项提升自身谈判筹码的策略选项，同时也是对台积电释出的预警
信号。
然而，目前尚无任何确切成果：既未交付晶圆，也无系统芯片进入实际运作阶段。现阶段
仅有设计开发套件（PDK）、技术蓝图以及市场分析推测。形象地说，虽然“比赛用球已
放上场”，但球场本身仍在施工中。至于英特尔是否能够正式参与竞赛，抑或再度被排除
在外，将取决于苹果是否做出关键表态：“Tape-out，我们加入。”
在此之前，这场角力仍只是充满策略意涵的外交谈判——以半导体作为谈判桌上的牺牲筹
码。
Source: WccfTech, 9to5mac
心得：
看了原文，就是一个市场的消息而已，
如同原文的结论所说，未交付晶圆也没有实际运作，都是市场推测
至于为何变成台湾新闻之后都会很惊悚就不得而知了XD
难不成又是传说中的"吓甩磨"吗~
各位半导体键盘分析师怎么看