1.原文连结：
http://au.ibtimes.com/articles/509408/20130927/iphone-6-release-date-liquidmetal-a8-chips.htm#.UkbP7iSwrIV
2.内容：
Talks of the iPhone 6 as the most advanced iOS smartphone yet on its 2014
release date are gaining more steam as new patents for the cutting-edge
mobile device frame and reports on ramped up production of A8 CPU emerged
An Apple phablet wrapped in LiquidMetal, according to Patently Apple, is ever
more approaching the sphere of reality as four new patents for the
manufacturing technology have been unearthed by the Apple-focused tech site.
The patents have been filed in Europe, said the same report, hinting of a new
gadget casing system that allows Apple to forge its future iOS devices in
irregular shapes, which gives credence to some iPhone 6 concepts depicting
the handset with wrap-around display screen.
Besides providing the technique for the tech giant to form its devices in
numerous form factors, LiquidMetal also boosts durability, likely making for
virtually indestructible iPhone housing. Note that the patent also applies to
future iPad makes.
The new patents, according to Patently Apple, point to the development of a
'fastener', which is "a hardware device that mechanically joins or affixes
two or more objects together."
Apple is focused on permanent fasteners, specifically those that include
"airtight and watertight zippers that could be used sealing electronic
devices, for example, the enclosure of a cell phone," said the report.
The tech giant also termed the patent as Bulk Metallic Glass, which in mobile
device manufacturing directly refers to the production of 'thin film of
amorphous metals' by injection moulding.
These can then "be deposited as protective coatings via a high velocity
oxygen fuel technique," Apple stated on the patent.
And it appears that the iPhone 6 killer features are not confined on the
outside as fresh reports from Asia indicate that Apple is gearing to shift
from A7 to A8 processing chips that use 20nm process nodes.
DigiTimes from Taiwan has reported this week that "Taiwan Semiconductor
Manufacturing Company (TSMC) has stepped up its purchases of manufacturing
equipment for its 20nm process."
By the first quarter of 2014, volume production of the chips will commence,
setting up iOS devices lined up for that year to boast of the same chip
architecture. Of course, the first to flash the new CPU is the rumoured
iPhone 6 that according to analyst will debut by the first half of the same
year.
The same handset is the bearer of major iPhone upgrades, Apple watchers said,
bannered by a larger screen that could breach the 5-inch mark, enhanced
security features that the iPhone 5S has introduced via the fingerprint
scanner Touch ID and wireless payment system using near-field communication
of NFC.
With technologies behind LiquidMetal and the A8 chip gaining more grounds,
the notion that the iPhone 6 is the real deal is shaping up nicely for Apple
fans.
Yet they may have to wait for some more time for their hopes to translate
into reality as the iPhone 6 release date countdown is not expected to begin
ticking until March 2014, which is the earliest debut target for the device.
3.心得/评论(必需填写)：
A7才刚出现蜜月都还没过
a8就开始在宣传了...
台gg要准备暴冲了吗?