台湾高通（QUALCOMM）2019年实习生招募中！预计上班时间为2019年寒假，职缺如下：
- Intern, Product Test Engineering (E1967236)
- Intern, Characterization Engineer (E1967391)
- Intern, Finger Print Process Engineer (E1967392)
- Intern, Test Engineer (E1967393)
- Intern, Supplier Quality Engineering (E1967394)
- Intern, Reliability Engineering (E1967395)
- Intern, Thermal Engineer (E1967396)
- Intern, Test Circuit Design Engineer (E1967425)
- Intern, RMA Engineer (E1967467)
- Intern, Device Data Analysis Engineer (E1967468)
- Intern, Spice Model Engineer (E1967470)
- Intern, Product & Test Engineering (E1967511)
- Intern, Reliability Engineer (E1967513)
- Intern, Planner (N1967390)
薪资范围：月薪23,100~40,000元，依工作时数计算
招募需求:
1. 实习期间须为在校生。
2. 欢迎电机电子、物理、材料、化工、工业工程管理等科系之硕班学生应征。
3.实习时数每周至少20个小时，为期三个月以上。
4. 请将您的英文履历和成绩单寄至 [email protected] 并注明您要应征的
职缺.
详细职缺内容请至www.qualcomm.com/careers 并用上列职缺号码搜寻。