安安各位
看到板上乱糟糟
让我们来看看 Intel CEO Gelsinger 到底说了啥
Gelsinger shared his vision for “IDM 2.0,” a major evolution of Intel’s
integrated device manufacturing (IDM) model.
Intel CEO 提出了所谓的 IDM 2.0 计画, 并且把他列为 Intel 接下来发展的 "Vision", 国外的企业非常重视所谓的愿景, 所以基本上他就是未来 Intel 在 integrated device manufacturer 上面的重大发展方向.
所以整场重点就是这个 IDM 2.0
IDM 2.0 represents the combination of three components that will enable the
company to drive sustained technology and product leadership:
IDM 2.0 主要有 3 个要点, 可以让 Intel 保持技术/产品领导地位. 基本上就是再次阐述这个 IDM 2.0 的重要性
1. Intel’s global, internal factory network for at-scale manufacturing is a key
competitive advantage that enables product optimization, improved economics
and supply resilience. Today, Gelsinger re-affirmed the company’s
expectation to continue manufacturing the majority of its products
internally. The company’s 7nm development is progressing well, driven by
increased use of extreme ultraviolet lithography (EUV) in a rearchitected,
simplified process flow. Intel expects to tape in the compute tile for its
first 7nm client CPU (code-named “Meteor Lake”) in the second quarter of
this year. In addition to process innovation, Intel’s leadership in
packaging technology is an important differentiator that enables the
combination of multiple IPs or “tiles” to deliver uniquely tailored
products that meet diverse customer requirements in a world of pervasive
computing.
Intel CEO 重申 (re-affirmed) 希望 Intel 可以继续在内部制造他们绝大多数的产品.
并且表明 Intel 7nm 目前的开发计画顺利, 已经导入跟台积电/三星一样的 EUV 技术, 预计今年第 2 季会将 7nm 技术用于下一代的 Meteor Lake 中.
注: Meteor Lake 是 Intel 2023 要问世的 CPU 代号