****代po***
朋友在intel Chandler AZ 组内有缺人。可帮忙看履历直接内推给招人经理。
至少要有美国合法签证（f1-pot, EAD）公司会帮忙办h1及绿卡。
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有意愿者请联系email: [email protected]
任何问题也请email联系
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Job description:
Microelectronic Packaging R&D Engineers provide project management, package de
sign/development and sustaining support for integrated circuit or semiconducto
r processes.
Responsibilities will include, but not be limited to:
‧Assembly processes and/or equipment development, and applying novel concepts
in ball attach technology solutions for next-generation CPUs and devices.
‧You will also be helping develop innovative solutions to enable Intel's road
map of future assembly packaging platform technologies. In this position, you
will be developing processes to meet quality, reliability, cost, yield, produc
tivity and manufacturability requirements.
‧Innovating, problem solving, developing, and continuously improving equipmen
t and processes using experimental design and statistical methods.
‧Process and equipment specification development, applying principles for des
ign of experiments and data analysis, and planning and documentation of improv
ements through the white paper process.
‧Developing solutions to problems utilizing formal education, statistical kno
wledge, and problem-solving tools.
‧Training production and process engineers for technology transfer to other f
actories worldwide for High Volume Manufacturing.
The ideal candidate should exhibit the following behavioral traits:
‧Proven technical leadership skills: leadership, strategic planning, coaching
and development of a technical team.
‧Demonstrated ability to successfully lead teams in a highly matrix environme
nt managing budgets, resources and timelines, as well as proven stakeholder ma
nagement.
‧Flexibility in changing priorities and responsibilities to support business
needs. Tolerance for ambiguity in a fast paced, constantly changing product ro
admap environment.
‧Strong influencing, written and verbal communication skills.
‧Self-initiated, Action-Oriented with the ability to work independently.
Qualifications
You must possess the below minimum qualifications to be initially considered f
or this position. Experience listed below would be obtained through a combinat
ion of your school work/classes/research and/or relevant previous job and/or i
nternship experiences.
Minimum Qualifications:
‧Possess a MS/PhD degree in Mechanical Engineering/Material Engineering/Elect
rical Engineering/Physics related field.
Preferred qualifications:
‧Strong knowledge of Statistical Process Control (SPC) and/or Design of Exper
iments (DOE) principles.
‧Hands-on participation and a strong sense of ownership; frequent floor prese
nce and interaction with manufacturing personnel.
‧Demonstrate technical innovation and delivered results for complex, time cri
tical technical projects; Fundamental understanding of semiconductor fabricati
on processes and technology with strong technical and analytical skills and pr
oblem-solving techniques.
‧Ability to apply fundamental science and engineering concepts in development
to create novel solutions.