先不谈三星挖角成功or叛将了，我们请google大神来看看台积未来n10发展趋势。
首先来看看n10要用什么技术
http://www.asml.com/doclib/investor/asml_3_Investor_Day-Many_ways_to_shrink_MvdBrink1.pdf
Slide25~30
1.10nm logic design can be done in 1D
..but at the penalty of 15% larger die at comparable design rules
2.EUV: reduced complexity & design rule simplification
Allowing 2D structures and potentially better yield
3.EUV lowest cost and complexity for 2D structures
4.Continued significant cost reduction viewed as possible
5.EUV supports “free functionality” for the 7nm node
再来看看台积对EUV技术的投资
http://optics.org/news/5/11/35
TSMC orders production EUV systems
ASML said that two NXE:3350B EUV systems were scheduled for delivery to TSMC
in 2015, while two other NXE:3300B systems that the chip maker already owns
will be upgraded to the full production-scale performance.
→已有两台再追加两台EUV量产机
http://electronics360.globalspec.com/article/4760/tsmc-orders-euv-lithography-tools-for-production
The new NXE:3350B machines are reported to cost €70 million (about US$90
million) although whether TSMC will pay that price or obtain discounts as
first user is likely to remain confidential
Van Hout said that 40W source has been demonstrated for continuous operation
for more than two months and that 80W operation was good for 24 hours and
that 100W has been demonsrated for a 60-minute run. An optical source power
of 80W is equivalent to about 55 wafers per hour or 500 wafers per day.
→一台EUV要价USD$90million →四台=360million USD
→80W EUV可提供55wafers/hour或是500 wafers/day
http://www.asml.com/doclib/investor/asml_6_Investor_Day-EUV_FvHout1.pdf
Slide13，Continuous stable source operation at 80W for 24 hrs.
→TSMC EUV机台已可提供稳定80W EUV power
→目前有2台x500 wafers/day 的n10产能
http://www.asml.com/doclib/investor/asml_6_Investor_Day-EUV_FvHout1.pdf
slide 17
Availability =50% →平均而言，两台只有一台在工作，但技术会随时间变成熟。
总结：当众多媒体还在唱虽台积电，但老张已经默默的带领台积进入下一世代，
即便叛将再强，能影响的也只是一个世代的制程，毕竟新一代的制程又是
新的挑战。
附记：柯P曾说过“阿米巴（原虫）被电到都会调整方向，连阿米巴的能力都没有。”
若是在PTT还不会用google判断媒体的是非对错，其实跟阿米巴也相差不远了。