小弟目前交大电信硕一 EDA实验室
未来想进S, C等 EDA公司
目前已经有一份N的APR intern offer
想请教台积这个职位工作内容主要是在做什么
如果跟APR也是大同小异可能就不面了
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职务名称: 2023 Intern 3DIC Design Flow 工作地点: 竹科Hsinchu Site
职务说明:
Job contents:
1. The main responsibility of this position is to enable TSMC 3D Fabric d
esign f
low. The employee will be able to learn the most advanced 3D integration techniq
ues, and co-work with 3DIC designers and flow solution providers to build up sta
ndard 3DIC development flow.
Job responsibilities:
1. 2.5D and 3D technology flow development, including
- Physical implementation, such as APR and InFO routing
- Electrical analysis, such as PDN, SI/PI, analog/RF extraction
- Physical verification, such as LVS, DRC
2. Advanced 2.5D/3D technology design