[新闻] HTC M9在世界通讯大会出现过热警告

楼主: ShawnInHK (卍龘龘龘卍)   2015-03-04 15:14:08
1.原文连结(必须检附):
http://ppt.cc/stEJ
2.原文内容:
The Mobile World Congress (MWC) is still on its way and many companies from
all over the world are showcasing their products in Barcelona. We’ve seen a
lot of great tech thus far, and the show still has a lot to offer it seems.
As you probably recall, both HTC and Samsung have introduced their new
flagship devices two days ago, HTC unveiled the One (M9) and Samsung
showcased both the Galaxy S6 and the Galaxy S6 Edge which have been leaking
all over the internet for a while now. That being said, these handset don’t
sport the same processors, HTC’s flagship is powered by Qualcomm’s
Snapdragon 810 64-bit octa-core chip, while Samsung decided to use their
proprietary 14nm Exynos 7420 64-bit octa-core unit.
Reports started coming in last December saying that Qualcomm’s chip has
overheating issues, also claiming that Samsung won’t use that chip for that
exact reason, and it seems like Samsung really has no intentions of releasing
the Snapdragon variant of the Galaxy S6 nor the Galaxy S6 Edge, at least they
didn’t say anything about that thus far. Now, back to the overheating
claims, both Qualcomm and LG denied such claims, saying that the Snapdragon
810 works just fine and does not overheat, but a new directly from MWC claims
just the opposite. According to a report from mobilissimo.ro portal, HTC One
(M9) had some issues running benchmarks at the MWC show floor in Barcelona.
One of the portal’s employees ran AnTuTu benchmarks on the One (M9) and the
phone was unable to complete the process it seems (image above). A warning
popped up saying the following: “The device temperature is too high. Please
test again after cooling the device. Continue testing may cause the system to
restart or shut down.”
http://ppt.cc/D0RS
On one hand, this really doesn’t have to mean anything, perhaps the device
was in function for way too long with screen being on all the time, which
could affect this problem. Perhaps it’s HTC’s fault, and it’s something
that the company can fix via software update. There’s always a possibility
this is a faulty unit and so on. On the other hand, however, Qualcomm’s
Snapdragon 810 SoC might really have issues with overheating, though it seems
weird we haven’t seen such problems coming from the G Flex 2 thus far, one
would think that internet’s full of images showing the very same thing.
3.心得/评论(必需填写):
不可质疑你的Hㄒㄈ!!
作者: thirteenflor (13楼)   2015-03-04 16:00:00
出新机 然后股价跌 这家公司一定出了什么问题
作者: kissa0924307 (瓦斯来一桶)   2015-03-04 16:22:00
高通卖芯片不只给一家 就Hㄒㄈ出问题....
作者: FALUNDAFAHOW ((法轮大法好!))   2015-03-04 16:28:00
内建暖暖包功能,好手机不买吗

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