请教一些新手问题。
active、tape out、ramp up，这些半导体界常看到的术语翻成白话是什么啊？
以上，肉脚新手发问，跪求前辈慈悲指教。
tape out
http://zh.wikipedia.org/wiki/%E4%B8%8B%E7%B7%9A
ramp up
https://qualitytaiwan.wordpress.com/2013/09/18/ramp-up-ramp-up-time/
各步骤顺序：
http://en.wikipedia.org/wiki/Integrated_circuit_design
Feasibility study and die size estimate
Function analysis
System Level Design
Analogue Design, Simulation & Layout
Digital Design, Simulation & Synthesis
System Simulation & Verification
Layout review
Design For Test and Automatic test pattern generation
Design for manufacturability (IC)
Tape-in
Mask data preparation
Tape-out 将设计好的芯片下线生产
Wafer fabrication
Die test
Packaging 封装
Post silicon validation and integration
Device characterization
Tweak (if necessary)
Datasheet generation Portable Document Format
Ramp up 良率爬升到可以量产的阶段
Production 量产
Yield Analysis / Warranty Analysis Reliability (semiconductor)
Failure analysis on any returns
Plan for next generation chip using production information if possible
可是还是没有查到active这个步骤，哭哭