认真回,NAND有试做过16stack(LVM)和32stack(技术宣誓,上胶体实在太厚了)。LPDDR4 目前 HVM 2 dice side by side, TTL 4 dice =4GB/PKG要做上去 4or 6 dice SBS,TTL 8 or 12 dice大概也会遇到胶体太厚塞不进CPU上面的小缝缝,或dice磨太薄,量产被歪棒直接插破dice的问题吧
https://i.imgur.com/zlrTmE5.jpghttps://i.imgur.com/6K1gHjh.jpgDRAM dice 叠叠乐快叠到天花板了,之后大概只能继续期TSV 3DIC了
https://i.imgur.com/ll6PvGE.jpg