※ 引述《upyours (hijos de puta)》之铭言：
: 借标题一问
: 制程nm越小，晶圆要曝光，光的波长就要越短，不然就狭缝绕射了
: 那光学机台的好坏对制程影响大吗？
: 那到底是哪些国家那些厂商在研发这些短波长机台？
: 感觉这些提供机台的制程军火商才是赚饱饱
: 还是说TSMC INTEL大家都用同样的机台，只是研发不一样的武功？
http://www.eetimes.com/document.asp?doc_id=1323296
IBM Breaks EUV Throughput Record
7/30/2014 01:20 PM EDT
SAN JOSE, Calif. – IBM reported better than expected results on its first
full day of testing the latest ASML extreme ultraviolet (EUV) lithography
system. The NXE3300B scanner produced 637 wafers in 24 hours at a steady rate
of 34 wafers/hour with a light source delivering 44W.
EUV is the leading candidate for printing fine patterns needed for next
generation chips. But the complex technology has been in the lab for more
than a decade. Even with IBM's latest results, it is still not expected to be
ready until the 7nm node, which may not start production until nearly 2020.
In its first day of tests, the scanner at IBM's Albany, N.Y., research lab
had a 77% uptime and delivered a 20mJ dose across 83 image fields/wafer with
full wafer coverage, including partial die. "We did have some interrupts
along the way, otherwise we would have produced more than 800 wafers in a
day," said Dan Corliss, IBM's EUV development program manager.
Corliss's team has been working on calibrating the scanner for two months. It
was delivered in components starting last November, initially with a 25W
light source.
The relatively weak light source has been one of the top challenges of EUV
systems, holding back throughput of at least 100 wafers/hour needed for high
volume manufacturing. Corliss said IBM hopes to get an 80W light source from
ASML in about six month
IBM's previous EUV system only exposed 7 wafers/day. ASML recently reported
the latest system had throughput of 145 wafers/day.
"We were pleasantly surprised by our results," Corliss said. "We've been
working on this technology for 12 years and this is a positive moment to
share with the industry... [but] it's not like we are in high-volume
manufacturing